Detail Design Capabilities

Mechanical Design – From board outline definition to full enclosure designs, our engineers have experience working with metal or plastic and in industries from consumer to military. We use 3D, parametric-based CAD systems. Our primary tool is SolidWorksTM, but through design partners, we can have designs completed in the CAD package of choice for each customer.

Cooling System Design – System cooling varies widely according to the power and thermal requirements of the individual application. From simple PCB thermal pads, to heat-sinks, to fan selection, to complete fantray design, we can provide the necessary expertise to insure system reliability and safety.

Electrical Circuit Design – Our engineering staff has extensive experience in both digital and analog design, including everything from single board design, to embedded system development. Previous designs have implemented processors and chips from Actel, Altera, AMCC, Cypress, Freescale, Intel, Microchip, Texas Instruments, Xilinx, and many others.

Component Engineering – Component engineering services include thru hole to SMT conversions, ROHS compliant conversions, alternate sourcing, and cost reduction.

Firmware Design – Low-level code for controllers, CPLDs, FPGAs, and other chips.

PCB CAD Layout – We have experience designing boards from simple to complex; from 2-46 layers, up to .25” thick, from standard FR-4 to high-performance materials, including high-temperature and low-dielectric constant materials. Our main layout tool is Cadence’s Allegro PCB design suite, however, we can also provide support for Expedition, Pads, and others.